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"Identification of Random/Clustered TSV Defects in 3D IC During Pre-Bond ..."

Dilip Kumar Maity, Surajit Kumar Roy, Chandan Giri (2019)

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DOI: 10.1007/S10836-019-05824-W

access: closed

type: Journal Article

metadata version: 2020-09-11

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Dilip Kumar Maity, Surajit Kumar Roy, Chandan Giri:
Identification of Random/Clustered TSV Defects in 3D IC During Pre-Bond Testing. J. Electron. Test. 35(5): 741-759 (2019)

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