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"Estimation of warpage and thermal stress of IVHs in flip-chip ball grid ..."

Seunghyun Cho, Soonjin Cho, Joseph Y. Lee (2008)

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DOI: 10.1016/J.MICROREL.2007.06.001

access: closed

type: Journal Article

metadata version: 2020-02-22

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Seunghyun Cho, Soonjin Cho, Joseph Y. Lee:
Estimation of warpage and thermal stress of IVHs in flip-chip ball grid arrays package by FEM. Microelectron. Reliab. 48(2): 300-309 (2008)

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