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"Reliability of Flip Chip Applications with Ceramic and Organic Chip Carriers."

Giulio Di Giacomo, Stefano Oggioni (2002)

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DOI: 10.1016/S0026-2714(02)00186-5

access: closed

type: Journal Article

metadata version: 2020-02-22

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  - https://dblp.org/rec/journals/mr/GiacomoO02
Giulio Di Giacomo, Stefano Oggioni:
Reliability of Flip Chip Applications with Ceramic and Organic Chip Carriers. Microelectron. Reliab. 42(9-11): 1541-1546 (2002)

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