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"Virtual qualification of moisture induced failures of advanced packages."

Marcel A. J. van Gils et al. (2007)

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DOI: 10.1016/J.MICROREL.2006.09.011

access: closed

type: Journal Article

metadata version: 2022-05-18

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Marcel A. J. van Gils, W. D. van Driel, G. Q. Zhang, H. J. L. Bressers, Richard B. R. van Silfhout, X. J. Fan, J. H. J. Janssen:
Virtual qualification of moisture induced failures of advanced packages. Microelectron. Reliab. 47(2-3): 273-279 (2007)

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