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"Interface delamination analysis of TQFP package during solder reflow."

Hu Guojun et al. (2010)

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DOI: 10.1016/J.MICROREL.2010.03.012

access: closed

type: Journal Article

metadata version: 2020-02-22

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  - https://dblp.org/rec/journals/mr/GuojunRLB10
Hu Guojun, Roberto Rossi, Jing-en Luan, Xavier Baraton:
Interface delamination analysis of TQFP package during solder reflow. Microelectron. Reliab. 50(7): 1014-1020 (2010)

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