Chunjing Hang Chunqing Wang M. Mayer Yanhong Tian Norman Y. Zhou Honghui Wang Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging. 416-424 2008 48 Microelectron. Reliab. 3 https://doi.org/10.1016/j.microrel.2007.06.008 https://www.wikidata.org/entity/Q57534416 db/journals/mr/mr48.html#HangWMTZW08