default search action

combined dblp search
author search
venue search
publication search

ask others

"Interfacial microstructure and bonding strength of Sn-3Ag-0.5Cu and ..."

Hsiu-Jen Lin, Tung-Han Chuang (2011)

> Home

Details and statistics

DOI: 10.1016/J.MICROREL.2010.07.061

access: closed

type: Journal Article

metadata version: 2020-02-22

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mr/LinC11
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/LinC11
Hsiu-Jen Lin, Tung-Han Chuang:
Interfacial microstructure and bonding strength of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-xZn solder BGA packages with immersion Ag surface finish. Microelectron. Reliab. 51(2): 445-452 (2011)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.