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"Investigating the CDM susceptibility of IC's at package and wafer level by ..."

Heinrich Wolf, Horst A. Gieser, Dirk Walter (2009)

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DOI: 10.1016/J.MICROREL.2009.10.006

access: closed

type: Journal Article

metadata version: 2020-02-22

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Heinrich Wolf, Horst A. Gieser, Dirk Walter:
Investigating the CDM susceptibility of IC's at package and wafer level by capacitive coupled TLP. Microelectron. Reliab. 49(12): 1476-1481 (2009)

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