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"Low-cycle fatigue testing and thermal fatigue life prediction of ..."

Kazuki Watanabe et al. (2018)

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DOI: 10.1016/J.MICROREL.2017.12.045

access: closed

type: Journal Article

metadata version: 2023-02-22

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  - journals/mr/WatanabeKYOHKMS18
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  - https://dblp.org/rec/journals/mr/WatanabeKYOHKMS18
Kazuki Watanabe, Yoshiharu Kariya, Naoyuki Yajima, Kizuku Obinata, Yoshiyuki Hiroshima, Shunichi Kikuchi, Akiko Matsui, Hiroshi Shimizu:
Low-cycle fatigue testing and thermal fatigue life prediction of electroplated copper thin film for through hole via. Microelectron. Reliab. 82: 20-27 (2018)

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