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"Effect of surface roughness of silicon die and copper heat spreader on ..."

Tong Hong Wang et al. (2011)

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DOI: 10.1016/J.MICROREL.2011.03.025

access: closed

type: Journal Article

metadata version: 2020-02-22

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Tong Hong Wang, Sara N. Paisner, Chang-Chi Lee, Susan Chen, Yi-Shao Lai:
Effect of surface roughness of silicon die and copper heat spreader on thermal performance of HFCBGA. Microelectron. Reliab. 51(8): 1372-1376 (2011)

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