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"Predicting bond failure after 1.5 ms of bonding, an initial study."

Aino Tietäväinen et al. (2014)

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DOI: 10.1016/J.MICROREL.2014.02.024

access: closed

type: Journal Article

metadata version: 2020-02-22

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  - https://dblp.org/rec/journals/mr/TietavainenRSKMH14
Aino Tietäväinen, Timo Rauhala, Henri Seppänen, Risto Kurppa, Antti I. Meriläinen, Edward Hæggström:
Predicting bond failure after 1.5 ms of bonding, an initial study. Microelectron. Reliab. 54(6-7): 1452-1454 (2014)

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