default search action

combined dblp search
author search
venue search
publication search

ask others

"Epoxy Chip-in-Carrier Integration and Screen-Printed Metalization for ..."

Lin Li, Heyu Yin, Andrew J. Mason (2018)

> Home

Details and statistics

DOI: 10.1109/TBCAS.2018.2797063

access: closed

type: Journal Article

metadata version: 2020-09-24

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/tbcas/LiYM18
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/tbcas/LiYM18
Lin Li, Heyu Yin, Andrew J. Mason:
Epoxy Chip-in-Carrier Integration and Screen-Printed Metalization for Multichannel Microfluidic Lab-on-CMOS Microsystems. IEEE Trans. Biomed. Circuits Syst. 12(2): 416-425 (2018)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.