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"Via-Based Redistribution Layer Routing for InFO Packages With Irregular ..."

Hsiang-Ting Wen et al. (2022)

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DOI: 10.1109/TCAD.2022.3155069

access: closed

type: Journal Article

metadata version: 2023-08-28

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  - https://dblp.org/rec/journals/tcad/WenCHC22
Hsiang-Ting Wen, Yu-Jie Cai, Yang Hsu, Yao-Wen Chang:
Via-Based Redistribution Layer Routing for InFO Packages With Irregular Pad Structures. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 41(12): 5554-5567 (2022)

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