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"Full-Chip Power Density and Thermal Map Characterization for Commercial ..."

Jinwei Zhang et al. (2022)

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DOI: 10.1109/TCAD.2021.3088081

access: closed

type: Journal Article

metadata version: 2022-05-18

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Jinwei Zhang, Sheriff Sadiqbatcha, Michael O'Dea, Hussam Amrouch, Sheldon X.-D. Tan:
Full-Chip Power Density and Thermal Map Characterization for Commercial Microprocessors Under Heat Sink Cooling. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 41(5): 1453-1466 (2022)

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