Yuan Zhang Chenghan Pu Muyuan Niu Qiaoyun Wu Wei Sun Jun Wang 0039 Gold Wire Bonding Quality Inspection of Integrated Circuit Based on Slenderness-Rotated Object Detection. 1-16 2025 74 IEEE Trans. Instrum. Meas. https://doi.org/10.1109/TIM.2025.3552386 db/journals/tim/tim74.html#ZhangPNWSW25 streams/journals/tim