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"PackMolds: computational design of packaging molds for thermoforming."

Naoki Kita (2024)

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DOI: 10.1007/S00371-024-03462-8

access: closed

type: Journal Article

metadata version: 2024-07-15

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Naoki Kita:
PackMolds: computational design of packaging molds for thermoforming. Vis. Comput. 40(7): 4689-4700 (2024)

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