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Mario Gonzalez
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2020 – today
- 2022
- [c12]Kookjin Lee, Ben Kaczer, Anastasiia Kruv, Mario Gonzalez, Geert Eneman, Oguzhan O. Okudur, Alexander Grill, Jacopo Franco, Andrea Vici, Robin Degraeve, Ingrid De Wolf:
Significant Enhancement of HCD and TDDB in CMOS FETs by Mechanical Stress. IRPS 2022: 10 - 2021
- [c11]Anastasiia Kruv, Sean R. C. McMitchell
, Sergiu Clima, Oguzhan O. Okudur
Impact of mechanical strain on wakeup of HfO2 ferroelectric memory. IRPS 2021: 1-6 - 2020
- [c10]Patricia Acosta-Vargas
Toward Accessible Mobile Application Development for Users with Low Vision. AHFE (7) 2020: 236-241 - [c9]Anastasiia Kruv, Ben Kaczer, Alexander Grill, Mario Gonzalez, Jacopo Franco, Dimitri Linten, Wolfgang Goes, Tibor Grasser, Ingrid De Wolf:
On the impact of mechanical stress on gate oxide trapping. IRPS 2020: 1-5
2010 – 2019
- 2019
- [c8]Patricia Acosta-Vargas
Improving Web Accessibility: Evaluation and Analysis of a Telerehabilitation Platform for Hip Arthroplasty Patients. AHFE (8) 2019: 508-519 - [c7]Anastasiia Kruv, Antonio Arreghini, Mario Gonzalez, Devin Verreck, Geert Van den Bosch, Ingrid De Wolf
Impact of Mechanical Stress on the Electrical Performance of 3D NAND. IRPS 2019: 1-5 - 2018
- [j10]Melina Lofrano, Vladimir Cherman, Mario Gonzalez
Enhanced Cu pillar design to reduce thermomechanical stress induced during flip chip assembly. Microelectron. Reliab. 87: 97-105 (2018) - [c6]Kristof Croes, Vladimir Cherman, Melina Lofrano, Houman Zahedmanesh, Luka Kljucar, Mario Gonzalez, Ingrid De Wolf
Stress mitigation of 3D-stacking/packaging induced stresses. IRPS 2018: 4 - 2017
- [j9]Kristof J. P. Jacobs
Lock-in thermal laser stimulation for non-destructive failure localization in 3-D devices. Microelectron. Reliab. 76-77: 188-193 (2017) - [j8]Luka Kljucar, Mario Gonzalez, Kristof Croes, Ingrid De Wolf, Joke De Messemaeker, Gayle Murdoch, Philip Nolmans, Joeri De Vos, Jürgen Bömmels, Eric Beyne
Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects. Microelectron. Reliab. 79: 297-305 (2017) - 2016
- [j7]Luka Kljucar, Mario Gonzalez, Ingrid De Wolf, Kristof Croes, Jürgen Bömmels, Zsolt Tökei
Evaluation of via density and low-k Young's modulus influence on mechanical performance of advanced node multi-level Back-End-Of-Line. Microelectron. Reliab. 56: 93-100 (2016) - [j6]Houman Zahedmanesh, Mario Gonzalez, Ivan Ciofi, Kristof Croes, Jürgen Bömmels, Zsolt Tökei
Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip-package interaction; a numerical investigation. Microelectron. Reliab. 59: 102-107 (2016) - [c5]Ehsan Monsef, Mario Gonzalez, Won-Jae Yi, Jafar Saniie:
Managing Quality of Service in Wireless Body Area Networks using CoAP. EIT 2016: 183-186 - 2015
- [j5]Michal Jablonski, Riccardo Lucchini, Frederick Bossuyt, Thomas Vervust
Impact of geometry on stretchable meandered interconnect uniaxial tensile extension fatigue reliability. Microelectron. Reliab. 55(1): 143-154 (2015) - [j4]Nabi Nabiollahi, Nele Moelans
Microstructure simulation of grain growth in Cu through silicon vias using phase-field modeling. Microelectron. Reliab. 55(5): 765-770 (2015) - [c4]Jan Ackaert, Tony Colpaert, Aditi Malik, Mario Gonzalez:
Metallization scheme optimization of plastic-encapsulated electronic power devices. ICICDT 2015: 1-4 - [c3]Mario Gonzalez, Victor M. Cárdenas
Nonexistent harmonics generation phenomenon caused by the processing of DQ transformation in power quality applications. ICIT 2015: 1355-1361 - 2012
- [c2]Wei Guo, Geert Van der Plas, Andrej Ivankovic, Geert Eneman, Vladimir Cherman, Bart De Wachter, Abdelkarim Mercha, Mario Gonzalez, Yann Civale, Augusto Redolfi, Thibault Buisson, A. Jourdan, Bart Vandevelde, Kenneth J. Rebibis, Ingrid De Wolf, Antonio La Manna, Gerald Beyer, Eric Beyne
3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps. ICICDT 2012: 1-4 - 2011
- [j3]Mario Gonzalez
Design and implementation of flexible and stretchable systems. Microelectron. Reliab. 51(6): 1069-1076 (2011)
2000 – 2009
- 2008
- [j2]Mario Gonzalez
Design of metal interconnects for stretchable electronic circuits. Microelectron. Reliab. 48(6): 825-832 (2008) - 2007
- [j1]Bart Vandevelde, Mario Gonzalez
Thermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages. Microelectron. Reliab. 47(2-3): 259-265 (2007) - 2006
- [c1]Mathieu Vanden Bulcke, Kris Baert, Eric Beyne
Active Electrode Arrays by Chip Embedding in a Flexible Silicone Carrier. EMBC 2006: 2811-2815
Coauthor Index
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