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Xin Huang 0003
Person information
- affiliation: University of California at Riverside, Department of Electrical and Computer Engineering, CA, USA
Other persons with the same name
- Xin Huang — disambiguation page
- Xin Huang 0001
— Hong Kong Baptist University, Hong Kong (and 2 more)
- Xin Huang 0002
- Xin Huang 0004 — Technical University of Denmark, Lyngby, Denmark
- Xin Huang 0005
- Xin Huang 0006
- Xin Huang 0007
- Xin Huang 0008 — CYAN, Petaluma, CA, USA (and 2 more)
- Xin Huang 0009
- Xin Huang 0010
- Xin Huang 0011 — Massachusetts Institute of Technology, Cambridge, MA, USA
- Xin Huang 0012 — Florida International University, Miami, FL, USA
- Xin Huang 0013
- Xin Huang 0014
- Xin Huang 0015
- Xin Huang 0016
- Xin Huang 0017
- Xin Huang 0018
- Xin Huang 0019 — Nanjing University, Software Institute, State Key Laboratory of Novel Software Technology, China
- Xin Huang 0020 — Texas State University, San Marcos, TX, USA
- Xin Huang 0021
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2010 – 2019
- 2017
- [j8]Xin Huang, Valeriy Sukharev
Dynamic electromigration modeling for transient stress evolution and recovery under time-dependent current and temperature stressing. Integr. 58: 518-527 (2017) - 2016
- [b1]Xin Huang:
Physics-Based Electromigration and Time Dependent Dielectric Breakdown Modeling and Reliability Analysis for Nanometer VLSI Circuits. University of California, Riverside, USA, 2016 - [j7]Kai He, Xin Huang, Sheldon X.-D. Tan:
EM-Based On-Chip Aging Sensor for Detection of Recycled ICs. IEEE Des. Test 33(5): 56-64 (2016) - [j6]Xin Huang, Valeriy Sukharev
Electromigration assessment for power grid networks considering temperature and thermal stress effects. Integr. 55: 307-315 (2016) - [j5]Hai-Bao Chen, Sheldon X.-D. Tan, Xin Huang, Taeyoung Kim
Analytical Modeling and Characterization of Electromigration Effects for Multibranch Interconnect Trees. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 35(11): 1811-1824 (2016) - [j4]Xin Huang, Armen Kteyan, Sheldon X.-D. Tan, Valeriy Sukharev
Physics-Based Electromigration Models and Full-Chip Assessment for Power Grid Networks. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 35(11): 1848-1861 (2016) - [c12]Xin Huang, Valeriy Sukharev
Electromigration recovery modeling and analysis under time-dependent current and temperature stressing. ASP-DAC 2016: 244-249 - [c11]Xin Huang, Valeriy Sukharev
Physics-based full-chip TDDB assessment for BEOL interconnects. DAC 2016: 45:1-45:6 - [c10]Taeyoung Kim, Xin Huang, Hai-Bao Chen, Valeriy Sukharev, Sheldon X.-D. Tan:
Learning-based dynamic reliability management for dark silicon processor considering EM effects. DATE 2016: 463-468 - [c9]Zeyu Sun, Ertugrul Demircan, Mehul D. Shroff, Taeyoung Kim
Voltage-based electromigration immortality check for general multi-branch interconnects. ICCAD 2016: 113 - 2015
- [j3]Hai-Bao Chen, Sheldon X.-D. Tan, David H. Shin, Xin Huang, Hai Wang, Guoyong Shi:
H2-matrix-based finite element linear solver for fast transient thermal analysis of high-performance ICs. Int. J. Circuit Theory Appl. 43(12): 1953-1970 (2015) - [j2]Hai-Bao Chen, Ying-Chi Li, Sheldon X.-D. Tan, Xin Huang, Hai Wang, Ngai Wong:
H-Matrix-Based Finite-Element-Based Thermal Analysis for 3D ICs. ACM Trans. Design Autom. Electr. Syst. 20(4): 47:1-47:25 (2015) - [j1]Zao Liu, Sheldon X.-D. Tan, Xin Huang, Hai Wang:
Task Migrations for Distributed Thermal Management Considering Transient Effects. IEEE Trans. Very Large Scale Integr. Syst. 23(2): 397-401 (2015) - [c8]Hai-Bao Chen, Sheldon X.-D. Tan, Xin Huang, Valeriy Sukharev
New electromigration modeling and analysis considering time-varying temperature and current densities. ASP-DAC 2015: 352-357 - [c7]Hai-Bao Chen, Sheldon X.-D. Tan, Valeriy Sukharev
Interconnect reliability modeling and analysis for multi-branch interconnect trees. DAC 2015: 90:1-90:6 - [c6]Kai He, Xin Huang, Sheldon X.-D. Tan:
EM-Based on-Chip Aging Sensor for Detection and Prevention of Counterfeit and Recycled ICs. ICCAD 2015: 146-151 - 2014
- [c5]Xin Huang, Tan Yu, Valeriy Sukharev
Physics-based Electromigration Assessment for Power Grid Networks. DAC 2014: 80:1-80:6 - [c4]Valeriy Sukharev
IR-drop based electromigration assessment: parametric failure chip-scale analysis. ICCAD 2014: 428-433 - [c3]Marko Chew, Ara Aslyan, Jun-Ho Choy, Xin Huang:
Accurate full-chip estimation of power map, current densities and temperature for EM assessment. ICCAD 2014: 440-445 - [c2]Ying-Chi Li
Direct finite-element-based solver for 3D-IC thermal analysis via H-matrix representation. ISQED 2014: 386-391 - 2013
- [c1]Zao Liu, Xin Huang, Sheldon X.-D. Tan, Hai Wang, He Tang:
Distributed task migration for thermal hot spot reduction in many-core microprocessors. ASICON 2013: 1-4
Coauthor Index
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