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Xing Wu 0005
Person information
- affiliation: East China Normal University, School of Communication and Electronic Engineering, Department of Electrical Engineering, Shanghai, China
Other persons with the same name
- Xing Wu — disambiguation page
- Xing Wu 0001
— Shanghai University, School of Computer Engineering and Science, Shanghai Institute for Advanced Communication and Data Science, Shanghai, China (and 4 more)
- Xing Wu 0002 — Kuaishou Technology, Beijing, China (and 2 more)
- Xing Wu 0003
- Xing Wu 0004 — Amazon, Seattle, WA, USA (and 1 more)
- Xing Wu 0006
- Xing Wu 0007
- Xing Wu 0008
- Xing Wu 0009 — Auburn University, Department of Electrical and Computer Engineering, Auburn, AL, USA
- Xing Wu 0010
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2020 – today
- 2023
- [j7]Shufan Yang
The Human Activity Radar Challenge: Benchmarking Based on the 'Radar Signatures of Human Activities' Dataset From Glasgow University. IEEE J. Biomed. Health Informatics 27(4): 1813-1824 (2023) - [c8]Qingzhen Wang, Wenxian Gu, Hengchang Bi, Liangjian Lyu, Deli Qiao, Xing Wu:
A Spike-Sorting-Assisted Compressed Sensing Processor for High-Density Neural Interfaces. ASICON 2023: 1-4 - [c7]Zijian Zhang, Q. Li, Zuoyuan Dong, Wanting Wang, S. T. Lai, Xin Yang, Fang Liang, Chaolun Wang, C. Luo, Liangjian Lyu, Z. Li, J. M. Xu, Xing Wu:
Microscopic Characterization of Failure Mechanisms in Long-Term Implanted Microwire Neural Electrodes. IRPS 2023: 1-5 - [c6]Zuoyuan Dong, Zixuan Sun
Catching the Missing EM Consequence in Soft Breakdown Reliability in Advanced FinFETs: Impacts of Self-heating, On-State TDDB, and Layout Dependence. VLSI Technology and Circuits 2023: 1-2 - 2022
- [j6]Haohan Wangxu
Flexible Pressure Sensor Array with Multi-Channel Wireless Readout Chip. Sensors 22(10): 3934 (2022) - [c5]Xinqian Chen, Fei Hou, Zuoyuan Dong, Yuxin Zhang, Chaolun Wang, Fang Liang, Feibo Du, Zhiwei Liu, Xing Wu:
Nanoscale Analysis of Breakdown Induced Crack Propagation in DTSCR Devices. IRPS 2022: 48-1 - 2021
- [j5]Tianyi Fan, Zheyu Liu, Zewei Luo, Junda Li, Xiyue Tian, Yeshen Chen, Yuan Feng, Chaolun Wang, Hengchang Bi, Xinming Li
Analog Sensing and Computing Systems with Low Power Consumption for Gesture Recognition. Adv. Intell. Syst. 3(1): 2000184 (2021) - [j4]Maimaiti Nazhamaiti
NS-MD: Near-Sensor Motion Detection With Energy Harvesting Image Sensor for Always-On Visual Perception. IEEE Trans. Circuits Syst. II Express Briefs 68(9): 3078-3082 (2021)
2010 – 2019
- 2019
- [j3]Zewei Luo, Xiaotong Hu, Xiyue Tian, Chen Luo, Hejun Xu, Quanling Li, Qianhao Li, Jian Zhang, Fei Qiao, Xing Wu
Structure-Property Relationships in Graphene-Based Strain and Pressure Sensors for Potential Artificial Intelligence Applications. Sensors 19(5): 1250 (2019) - [c4]Zheyu Liu, Zichen Fan, Qi Wei, Xing Wu, Fei Qiao, Ping Jin, Xinjun Liu, Chengliang Liu, Huazhong Yang:
Design of Switched-Current Based Low-Power PIM Vision System for IoT Applications. ISVLSI 2019: 181-186 - [c3]Zheyu Liu, Erxiang Ren
A 1.8mW Perception Chip with Near-Sensor Processing Scheme for Low-Power AIoT Applications. ISVLSI 2019: 447-452 - [c2]Changlu Liu, Tianxiang Lan, Qin Li, Kaige Jia, Yidian Fan, Xing Wu, Fei Qiao, Wei Qi, Xin-Jun Liu, Huazhong Yang:
Energy-efficient Analog Processing Architecture for Direction of Arrival with Microphone Array. ISVLSI 2019: 507-512 - 2017
- [c1]Qin Li, Zheyu Liu, Fei Qiao, Xing Wu, Chaolun Wang, Qi Wei, Huazhong Yang:
From "MISSION: IMPOSSIBLE" to mission possible: Fully flexible intelligent contact lens for image classification with analog-to-information processing. ISCAS 2017: 1-4 - 2016
- [j2]Sen Mei, Michel Bosman
Compliance current dominates evolution of NiSi2 defect size in Ni/dielectric/Si RRAM devices. Microelectron. Reliab. 61: 71-77 (2016) - 2015
- [j1]Y. Y. Tan, Q. L. Yang, K. S. Sim
Cu-Al intermetallic compound investigation using ex-situ post annealing and in-situ annealing. Microelectron. Reliab. 55(11): 2316-2323 (2015)
Coauthor Index
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