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Fengjuan Wang
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2020 – today
- 2024
- [j38]Meng Pang
, Fengjuan Wang, Zhe Li
Credit risk prediction based on an interpretable three-way decision method: Evidence from Chinese SMEs. Appl. Soft Comput. 157: 111538 (2024) - [j37]Zhaoqilin Yang
EPK-CLIP: External and Priori Knowledge CLIP for action recognition. Expert Syst. Appl. 252: 124183 (2024) - [j36]Fengjuan Wang, Jiashuo Ren, Xiangkun Yin, Ningmei Yu, Yuan Yang, Kai Jing, Qian Li:
Effect of annealing residual stress on mobility of TSV vertical switch. IEICE Electron. Express 21(10): 20240208 (2024) - [j35]Fengjuan Wang, Jilin Kou, Xiangkun Yin
A compact fifth-order SIW BPF based on TSV technology with high selectivity. Microelectron. J. 144: 106067 (2024) - [c9]Ruonan Zhang
Synergetic Prototype Learning Network for Unbiased Scene Graph Generation. ACM Multimedia 2024: 945-954 - 2023
- [j34]Fengjuan Wang, Zhuoyu Yang, Xiangkun Yin, Ningmei Yu, Yuan Yang:
TSV-based SIW bandpass filter with adjustable transmission zeros for D-band applications. IEICE Electron. Express 20(10): 20230116 (2023) - [j33]Fengjuan Wang, Ying Lu, Xiangkun Yin
Miniaturized silicon-based substrate integrated waveguide filter for 6G applications. Microelectron. J. 138: 105837 (2023) - 2022
- [j32]Fengjuan Wang, Sa Xiao, Xiangkun Yin, Ningmei Yu, Yuan Yang:
A miniature TSV-based branch line coupler using π equivalent circuit model for transmission line. IEICE Electron. Express 19(3): 20210515 (2022) - [j31]Xiangkun Yin, Jingyu Lu, Fengjuan Wang:
Wideband transmission optimization for heterogenous interconnection in 3D IC. IEICE Electron. Express 19(5): 20210559 (2022) - [j30]Fengjuan Wang, Quan Peng, Ningmei Yu, Yuan Yang:
TSV-based SIW bandpass filter for W-band mobile communication applications. IEICE Electron. Express 19(12): 20220187 (2022) - [j29]Xiangkun Yin, Jingyu Lu, Fengjuan Wang
Optimization of heterogeneous interconnection transmission based on impedance matching for 3-D IC high-frequency application. Microelectron. J. 119: 105317 (2022) - [j28]Fengjuan Wang
Compact high-performance dual-frequency power divider based on TSV. Microelectron. J. 129: 105580 (2022) - [j27]Fengjuan Wang
A Miniaturized Wideband Interdigital Bandpass Filter With High Out-Band Suppression Based on TSV Technology for W-Band Application. IEEE Trans. Very Large Scale Integr. Syst. 30(7): 989-992 (2022) - 2021
- [j26]Fengjuan Wang
Compact TSV-Based Hairpin Bandpass Filter for Thz Applications. IEEE Access 9: 132078-132083 (2021) - [j25]Fengjuan Wang, Baoju Zhang, Cuiping Zhang, Wenrui Yan, Zhiyang Zhao, Man Wang:
Low-light image joint enhancement optimization algorithm based on frame accumulation and multi-scale Retinex. Ad Hoc Networks 113: 102398 (2021) - [j24]Zhiyang Zhao, Baoju Zhang, Bo Zhang, Cuiping Zhang, Man Wang, Wenrui Yan, Fengjuan Wang:
A novel optimization method for WSN based on mixed matrix decomposition of NMF and 2-SVD-QR. Ad Hoc Networks 115: 102454 (2021) - [j23]Fengjuan Wang, Lei Ke, Xiangkun Yin, Vasilis F. Pavlidis, Ningmei Yu, Yuan Yang:
TSV-based hairpin bandpass filter for 6G mobile communication applications. IEICE Electron. Express 18(15): 20210247 (2021) - [j22]Xiangkun Yin, Fengjuan Wang:
Analytical models of AC inductance and quality factor for TSV-based inductor. IEICE Electron. Express 18(18): 20210319 (2021) - [j21]Fengjuan Wang
A transformer with high coupling coefficient and small area based on TSV. Integr. 81: 211-220 (2021) - [j20]Xiangkun Yin
Design of compact LC lowpass filters based on coaxial through-silicon vias array. Microelectron. J. 116: 105217 (2021)
2010 – 2019
- 2019
- [j19]Baoju Zhang
Multispectral Heterogeneity Detection Based on Frame Accumulation and Deep Learning. IEEE Access 7: 29277-29284 (2019) - [j18]Chengcheng Zhang, Baoju Zhang, Gang Li, Ling Lin, Cuiping Zhang, Fengjuan Wang:
A Preprocessing Algorithm Based on Heterogeneity Detection for Transmitted Tissue Image. EURASIP J. Wirel. Commun. Netw. 2019: 209 (2019) - [j17]Fengjuan Wang, He Li, Ningmei Yu:
Investigation on impact of substrate on low-pass filter based on coaxial TSV. IEICE Electron. Express 16(2): 20180992 (2019) - [j16]Fengjuan Wang, Jia Huang, Ningmei Yu:
A high-pass filter based on through-silicon via (TSV). IEICE Electron. Express 16(10): 20190098 (2019) - [j15]Xianjin Liu
Fiber Ring Laser Directional Torsion Sensor with Ultra-Wide Linear Response. Sensors 19(16): 3613 (2019) - [c8]Baoju Zhang, Chengcheng Zhang, Gang Li, Ling Lin, Cuiping Zhang, Fengjuan Wang:
Single-Channel Grayscale Processing Algorithm for Transmission Tissue Images Based on Heterogeneity Detection. CSPS 2019: 520-528 - [c7]Baoju Zhang, Fengjuan Wang, Gang Li, Cuiping Zhang, Chengcheng Zhang:
A Multispectral Image Edge Detection Algorithm Based on Improved Canny Operator. CSPS 2019: 1298-1307 - 2018
- [j14]Fengjuan Wang, Hongjun Cao:
Mode locking and quasiperiodicity in a discrete-time Chialvo neuron model. Commun. Nonlinear Sci. Numer. Simul. 56: 481-489 (2018) - [j13]Fengjuan Wang, Jia Huang, Ningmei Yu:
A novel guard method of through-silicon-via (TSV). IEICE Electron. Express 15(11): 20180421 (2018) - [c6]Andrew Placona, Fengjuan Wang, Rich King:
Longitudinal Clustering of High Cost Patients' Spend Trajectories: Delineating Individual Behaviors from Aggregate Trends. AMIA 2018 - 2017
- [j12]Fengjuan Wang, Gang Wang, Ningmei Yu:
Equivalent circuit model of through-silicon-via in slow wave mode. IEICE Electron. Express 14(22): 20171025 (2017) - [j11]Fengjuan Wang
An Ultracompact Butterworth Low-Pass Filter Based on Coaxial Through-Silicon Vias. IEEE Trans. Very Large Scale Integr. Syst. 25(3): 1164-1167 (2017) - [c5]Andrew Placona, Fengjuan Wang, Shantanu Phatakwala, Nick Toure:
Data Munging Tricks Can Build Better High Risk Maternity Predictive Models. AMIA 2017 - 2016
- [j10]Fengjuan Wang, Ningmei Yu:
Thermal management of coaxial through-silicon-via (C-TSV)-based three-dimensional integrated circuit (3D IC). IEICE Electron. Express 13(11): 20151117 (2016) - [j9]Fengjuan Wang, Ningmei Yu:
Explicit model of thermal stress induced by annular through-silicon-via (TSV). IEICE Electron. Express 13(21): 20160767 (2016) - 2015
- [j8]Fengjuan Wang, Ningmei Yu, Zhangming Zhu, Xiangkun Yin, Yintang Yang:
Effects of coaxial through-silicon via on carrier mobility along [100] and [110] crystal directions of (100) silicon. IEICE Electron. Express 12(14): 20150434 (2015) - [j7]Fengjuan Wang, Ningmei Yu:
Study on thermal stress and keep-out zone induced by Cu and SiO2 filled coaxial-annular through-silicon via. IEICE Electron. Express 12(22): 20150844 (2015) - [j6]Shigang Wang, Yong Yan, Fengjuan Wang, Guanxiong Wu:
Based on reverse molding technology of the impeller of the fluid dynamics analysis. J. Comput. Methods Sci. Eng. 15(2): 183-192 (2015) - [c4]Jie Jin, Hui Liu, Fengjuan Wang, Hong Peng, Jun Wang:
Parallel Implementation of P Systems for Data Clustering on GPU. BIC-TA 2015: 200-211 - 2014
- [j5]Fengjuan Wang, Zhangming Zhu, Yintang Yang, Xiaoxian Liu, Ruixue Ding:
Capacitance characterization of tapered through-silicon-via considering MOS effect. Microelectron. J. 45(2): 205-210 (2014) - 2013
- [j4]Xiaoxian Liu, Zhangming Zhu, Yintang Yang, Fengjuan Wang, Ruixue Ding:
Reduction of signal reflection in high-frequency three-dimensional (3D) integration circuits. IEICE Electron. Express 10(14): 20130449 (2013) - [j3]Fengjuan Wang, Zhangming Zhu, Yintang Yang, Xiaoxian Liu, Ruixue Ding:
Analytical models for the thermal strain and stress induced by annular through-silicon-via (TSV). IEICE Electron. Express 10(20): 20130666 (2013) - [j2]Fengjuan Wang, Zhangming Zhu, Yintang Yang, Xiaoxian Liu, Ruixue Ding:
Thermo-mechanical performance of Cu and SiO2 filled coaxial through-silicon-via (TSV). IEICE Electron. Express 10(24): 20130894 (2013) - [j1]Shigang Wang, Fangfang Zhou, Fengjuan Wang:
Effect of Inertia Weight w on PSO-SA Algorithm. Int. J. Online Biomed. Eng. 9(S6): 87-91 (2013) - 2011
- [c3]Fengjuan Wang, Zhangming Zhu, Yintang Yang, Ning Wang:
A thermal model for the top layer of 3D integrated circuits considering through silicon vias. ASICON 2011: 618-620 - [c2]Fengjuan Wang, Zhihua Xie:
Is Internal Capital Market of China Listed Companies Efficient? - Empirical Evidences from Listed Companies Which Have Multiple Divisions in H-stock. ICEIS (4) 2011: 600-605
2000 – 2009
Coauthor Index
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