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Norman Chang
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2020 – today
- 2024
- [c40]Henian Li, Lang Lin, Norman Chang, Sreeja Chowdhury, Dylan Mcguire, Bozidar Novakovic, Kazuki Monta, Makoto Nagata, Ying-Shiun Li, Pramod M. S, Piin-Chen Yeh, Jyh-Shing Roger Jang, Chengjie Xi, Qiutong Jin, Navid Asadi, Mark M. Tehranipoor:
Photon Emission Modeling and Machine-Learning Assisted Pre-Silicon Optical Side-Channel Simulation. HOST 2024: 107-111 - [c39]Tianhao Zhang, Norman Chang:
Design for Reliability (DFR) Aware EDA Solution for Product Reliability (Invited). IRPS 2024: 1-6 - [c38]Wei-Shen Wang, Zhe-Jia Liang, James Chien-Mo Li, Norman Chang, Akhilesh Kumar, Ying-Shiun Li:
Thermal-Aware Test Frequency Optimization. ITC-Asia 2024: 1-5 - [c37]Haiyang He
, Norman Chang
Parallel Per-tile Activation with Linear Superposition of Thermal Response for Solving Arbitrary Power Pattern in 3DIC Thermal Simulation. MLCAD 2024: 12:1-12:7 - 2023
- [j3]Kazuki Monta
Silicon-correlated Simulation Methodology of EM Side-channel Leakage Analysis. ACM J. Emerg. Technol. Comput. Syst. 19(1): 9:1-9:23 (2023) - [c36]Haiyang He, Norman Chang, Jie Yang, Akhilesh Kumar, Wenbo Xia, Lang Lin, Rishikesh Ranade:
Invited Paper: Solving Fine-Grained Static 3DIC Thermal with ML Thermal Solver Enhanced with Decay Curve Characterization. ICCAD 2023: 1-7 - [c35]Zhe-Jia Liang, Yu-Tsung Wu, Yun-Feng Yang, James Chien-Mo Li, Norman Chang, Akhilesh Kumar, Ying-Shiun Li:
High-Speed, Low-Storage Power and Thermal Predictions for ATPG Test Patterns. ITC 2023: 206-215 - [c34]Norman Chang:
ML-augmented Simulation and Co-optimization for Semiconductor Applications and Design WorkflowsBeyond. MLCAD 2023: 1 - [i3]Yu-Chen Lin
Applications of Large Language Models in Data Processing: Innovative Approaches to Segmenting and Renewing Information. CoRR abs/2311.16267 (2023) - 2022
- [c33]Jia-Xian Chen, Shi-Tang Liu, Yu-Tsung Wu, Mu-Ting Wu, Chien-Mo James Li, Norman Chang, Ying-Shiun Li, Wentze Chuang:
Vector-based Dynamic IR-drop Prediction Using Machine Learning. ASP-DAC 2022: 202-207 - [c32]Nitin Pundir
Security Properties Driven Pre-Silicon Laser Fault Injection Assessment. HOST 2022: 9-12 - [c31]Lang Lin, Jimin Wen, Harsh Shrivastav, Weike Li, Hua Chen, Gang Ni, Sreeja Chowdhury, Calvin Chow, Norman Chang:
Layout-level Vulnerability Ranking from Electromagnetic Fault Injection. HOST 2022: 17-20 - [c30]Shi-Tang Liu, Jia-Xian Chen, Yu-Tsung Wu, Chao-Ho Hsieh, Chien-Mo James Li, Norman Chang, Ying-Shiun Li, Wentze Chuang:
Low-IR-Drop Test Pattern Regeneration Using A Fast Predictor. ISQED 2022: 27-32 - [c29]Rishikesh Ranade, Haiyang He, Jay Pathak, Norman Chang, Akhilesh Kumar, Jimin Wen:
A Thermal Machine Learning Solver For Chip Simulation. MLCAD 2022: 111-117 - [c28]Akhilesh Kumar, Norman Chang, David Geb, Haiyang He, Stephen H. Pan, Jimin Wen, Saeed Asgari, Mehdi Abarham, Chris Ortiz:
ML-based Fast On-Chip Transient Thermal Simulation for Heterogeneous 2.5D/3D IC Designs. VLSI-DAT 2022: 1-8 - [i2]Rishikesh Ranade, Haiyang He, Jay Pathak, Norman Chang, Akhilesh Kumar, Jimin Wen:
A Thermal Machine Learning Solver For Chip Simulation. CoRR abs/2209.04741 (2022) - 2021
- [c27]Norman Chang, Deqi Zhu, Lang Lin, Dinesh Selvakumaran, Jimin Wen, Stephen H. Pan, Wenbo Xia, Hua Chen, Calvin Chow, Gary Chen:
ML-augmented Methodology for Fast Thermal Side-channel Emission Analysis. ASP-DAC 2021: 463-468 - [c26]Lang Lin, Deqi Zhu, Jimin Wen, Hua Chen, Yu Lu, Norman Chang, Calvin Chow, Harsh Shrivastav, Chia-Wei Chen, Kazuki Monta, Makoto Nagata:
Multiphysics Simulation of EM Side-Channels from Silicon Backside with ML-based Auto-POI Identification. HOST 2021: 270-280 - [i1]Rishikesh Ranade, Chris Hill, Haiyang He, Amir Maleki, Norman Chang, Jay Pathak:
A composable autoencoder-based iterative algorithm for accelerating numerical simulations. CoRR abs/2110.03780 (2021) - 2020
- [c25]Lang Lin, Dinesh Selvakumaran, Deqi Zhu, Norman Chang, Calvin Chow, Makoto Nagata
Fast and Comprehensive Simulation Methodology for Layout-Based Power-Noise Side-Channel Leakage Analysis. iSES 2020: 133-138
2010 – 2019
- 2019
- [c24]Norman Chang, Wentze Chuang, Ganesh Kumar Tsavatanalli, Joao Geada, Hao Zhuang, Sankar Ramachandran, Rahul Rajan, Ying-Shiun Li, Yaowei Jia, Mathew Kaipanatu, Suresh Kumar Mantena, Ming-Chih Shih, Anita Yang, Jyh-Shing Roger Jang:
Applying Machine Learning to Design for Reliability Coverage. IRPS 2019: 1-7 - 2018
- [j2]Norman Chang, Stephen H. Pan, Karthik Srinivasan, Zhigang Feng, Wenbo Xia, Tim Pawlak, David Geb:
Emerging ADAS Thermal Reliability Needs and Solutions. IEEE Micro 38(1): 66-81 (2018) - [c23]Norman Chang, Ajay Baranwal, Hao Zhuang, Ming-Chih Shih, Rahul Rajan, Yaowei Jia, Hui-Lun Liao, Ying-Shiun Li, Ting Ku, Rex Lin:
Machine learning based generic violation waiver system with application on electromigration sign-off. ASP-DAC 2018: 416-421 - 2017
- [c22]Chia-Wei Wu, Fuchun Joseph Lin
OneM2M-based IoT protocol integration. CSCN 2017: 252-257 - 2015
- [c21]Chi-Sheng Shih
Multi-tier Elastic Computation Framework for Mobile Cloud Computing. MobileCloud 2015: 223-232 - 2014
- [j1]Chi-Sheng Shih
Heterogeneous and Elastic Computation Framework for Mobile Cloud Computing. Int. J. Softw. Eng. Knowl. Eng. 24(7): 1013-1038 (2014) - [c20]Ming-Chang Yang, Yuan-Hung Kuan
Bad page relaxation to prolong the lifetime of flash devices. GCCE 2014: 715-716 - [c19]Chi-Sheng Shih
Imprecise Computation Over the Cloud. MobileCloud 2014: 29-37 - [c18]Nien-I Hsu, Tseng-Yi Chen
Dynamic tail packing to optimize space utilization of file systems in embedded computing systems. RTCSA 2014: 1-10 - 2013
- [c17]Stephen H. Pan, Norman Chang, Tadaaki Hitomi:
3D-IC dynamic thermal analysis with hierarchical and configurable chip thermal model. 3DIC 2013: 1-8 - [c16]Shih-Hao Hung
Performance and Power Estimation for Mobile-Cloud Applications on Virtualized Platforms. IMIS 2013: 260-267 - [c15]Chi-Sheng Shih
Virtual Cloud Core: OpenCL Workload Sharing Framework for Connected Devices. SOSE 2013: 486-493 - 2012
- [c14]Chi-Sheng Shih
A VM-aware fairness scheduler on heterogenous multi-core platforms. RACS 2012: 409-415
2000 – 2009
- 2009
- [c13]Kai Wang, Aveek Sarkar, Norman Chang, Shen Lin:
Early analysis for power distribution networks. ISPD 2009: 3-4 - 2002
- [c12]Norman Chang:
Power/Ground Integrity Issues for Sub-130nm IC Designs (Tutorial Abstract). ISQED 2002: 10 - 2001
- [c11]Shen Lin, Norman Chang:
Challenges in Power-Ground Integrity. ICCAD 2001: 651- - [c10]Yu Cao, Xuejue Huang, Chenming Hu, Norman Chang, Shen Lin, O. Sam Nakagawa, Weize Xie:
Effective On-chip Inductance Modeling for Multiple Signal Lines and Application on Repeater Insertion. ISQED 2001: 185-190 - [c9]Zhenyu Tang, Lei He, Norman Chang, Shen Lin, Weize Xie, O. Sam Nakagawa:
Instruction Prediction for Step Power Reduction. ISQED 2001: 211-216 - 2000
- [c8]Xiaoning Qi, Gaofeng Wang
On-chip inductance modeling and RLC extraction of VLSI interconnects for circuit simulation. CICC 2000: 487-490 - [c7]Norman Chang, Shen Lin, O. Sam Nakagawa, Weize Xie, Lei He:
Clocktree RLC Extraction with Efficient Inductance Modeling. DATE 2000: 522-526 - [c6]Zhiping Yu, Dan Yergeau, Robert W. Dutton, O. Sam Nakagawa, Norman Chang, Shen Lin, Weize Xie:
Full Chip Thermal Simulation. ISQED 2000: 145-150 - [c5]Shen Lin, Norman Chang, O. Sam Nakagawa:
Quick On-Chip Self- and Mutual-Inductance Screen. ISQED 2000: 513- - [c4]Zhenyu Tang, Norman Chang, Shen Lin, Weize Xie, O. Sam Nakagawa, Lei He:
Ramp Up/Down Functional Unit to Reduce Step Power. PACS 2000: 13-24
1990 – 1999
- 1999
- [c3]Lei He, Norman Chang, Shen Lin, O. Sam Nakagawa:
An efficient inductance modeling for on-chip interconnects. CICC 1999: 457-460 - 1997
- [c2]Norman Chang, Valery Kanevsky, O. Sam Nakagawa, Khalid Rahmat, Soo-Young Oh:
Fast Generation of Statistically-based Worst-Case Modeling of On-Chip Interconnect. ICCD 1997: 720-725 - 1992
- [c1]Soo-Young Oh, Keh-Jeng Chang, Norman Chang, Ken Lee:
Interconnect Modeling and Design in High-Speed VLSI/ULSI Systems. ICCD 1992: 184-189
Coauthor Index
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