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"Towards Chip-Package-System Co-optimization of Thermally-limited ..."

Subrat Mishra et al. (2023)

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DOI: 10.1109/IRPS48203.2023.10117979

access: closed

type: Conference or Workshop Paper

metadata version: 2024-05-07

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  dblp key:
  - conf/irps/MishraVVBLAOBZHPWHMCR23
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  - https://dblp.org/rec/conf/irps/MishraVVBLAOBZHPWHMCR23
Subrat Mishra, Sankatali Venkateswarlu, Bjorn Vermeersch, Moritz Brunion, Melina Lofrano, Dawit Burusie Abdi, Herman Oprins, Dwaipayan Biswas, Odysseas Zografos, Gaspard Hiblot, Geert Van der Plas, Pieter Weckx, Geert Hellings, James Myers, Francky Catthoor, Julien Ryckaert:
Towards Chip-Package-System Co-optimization of Thermally-limited System-On-Chips (SOCs). IRPS 2023: 1-7

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