"Through Silicon Capacitive Coupling (TSCC) interface for 3D stacked dies."

Katsuyuki Ikeuchi, Makoto Takamiya, Takayasu Sakurai (2011)

Details and statistics

DOI: 10.1109/3DIC.2012.6263045

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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