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"A Modular 1 mm3 Die-Stacked Sensing Platform With Low Power ..."

Yoonmyung Lee et al. (2013)

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DOI: 10.1109/JSSC.2012.2221233

access: closed

type: Journal Article

metadata version: 2024-11-14

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  - https://dblp.org/rec/journals/jssc/LeeBLKKGPDSB13
Yoonmyung Lee, Suyoung Bang, Inhee Lee, Yejoong Kim, Gyouho Kim, Mohammad Hassan Ghaed, Pat Pannuto, Prabal Dutta, Dennis Sylvester, David T. Blaauw:
A Modular 1 mm³ Die-Stacked Sensing Platform With Low Power I²C Inter-Die Communication and Multi-Modal Energy Harvesting. IEEE J. Solid State Circuits 48(1): 229-243 (2013)

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