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"Effect of solder pads on the fatigue life of FBGA memory modules under ..."

Yusuf Cinar et al. (2013)

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DOI: 10.1016/J.MICROREL.2013.06.018

access: closed

type: Journal Article

metadata version: 2020-02-22

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  - https://dblp.org/rec/journals/mr/CinarJJKJ13
Yusuf Cinar, Jinwoo Jang, Gunhee Jang, Seonsik Kim, Jaeseok Jang:
Effect of solder pads on the fatigue life of FBGA memory modules under harmonic excitation by using a global-local modeling technique. Microelectron. Reliab. 53(12): 2043-2051 (2013)

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