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"Analysis of Cu/low-k bond pad delamination by using a novel failure index."

Marcel A. J. van Gils et al. (2007)

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DOI: 10.1016/J.MICROREL.2006.09.003

access: closed

type: Journal Article

metadata version: 2023-09-30

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  - https://dblp.org/rec/journals/mr/GilsSZJV07
Marcel A. J. van Gils, Olaf van der Sluis, G. Q. Zhang, J. H. J. Janssen, R. M. J. Voncken:
Analysis of Cu/low-k bond pad delamination by using a novel failure index. Microelectron. Reliab. 47(2-3): 179-186 (2007)

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