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"Cyclic bending reliability of wafer-level chip-scale packages."

Yi-Shao Lai et al. (2007)

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DOI: 10.1016/J.MICROREL.2006.04.010

access: closed

type: Journal Article

metadata version: 2020-02-22

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  - https://dblp.org/rec/journals/mr/LaiWTJ07
Yi-Shao Lai, Tong Hong Wang, Han-Hui Tsai, Ming-Hwa R. Jen:
Cyclic bending reliability of wafer-level chip-scale packages. Microelectron. Reliab. 47(1): 111-117 (2007)

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