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"Size and constraint effects on interfacial fracture behavior of microscale ..."

B. Li et al. (2013)

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DOI: 10.1016/J.MICROREL.2012.07.033

access: closed

type: Journal Article

metadata version: 2020-02-22

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B. Li, X. P. Zhang, Y. Yang, L. M. Yin, Michael G. Pecht:
Size and constraint effects on interfacial fracture behavior of microscale solder interconnects. Microelectron. Reliab. 53(1): 154-163 (2013)

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