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"The impact of moisture in mold compound preforms on the warpage of PBGA ..."

T. Y. Lin et al. (2004)

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DOI: 10.1016/J.MICROREL.2003.08.003

access: closed

type: Journal Article

metadata version: 2020-02-22

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T. Y. Lin, B. Njoman, D. Crouthamel, K. H. Chua, S. Y. Teo, Y. Y. Ma:
The impact of moisture in mold compound preforms on the warpage of PBGA packages. Microelectron. Reliab. 44(4): 603-609 (2004)

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