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"Experimental and numerical analysis of BGA lead-free solder joint ..."

Fang Liu et al. (2009)

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DOI: 10.1016/J.MICROREL.2008.10.014

access: closed

type: Journal Article

metadata version: 2020-02-22

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Fang Liu, Guang Meng, Mei Zhao, Jun feng Zhao:
Experimental and numerical analysis of BGA lead-free solder joint reliability under board-level drop impact. Microelectron. Reliab. 49(1): 79-85 (2009)

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