New optical three dimensional structure measurement method of cone shape micro bumps used for 3D LSI chip stacking. - Aoyagi, Masahiro; Watanabe, Naoya; Suzuki, Motohiro; Kikuchi, Katsuya; Nemoto, Shunsuke; Arima, Noriaki; Ishizuka, Misaki; Suzuki, Koji; Shiomi, Toshio (2013)