Impact of 3D copper TSV integration on 32SOI FEOL and BEOL reliability - Mukta G. Farooq; Giuseppe La Rosa; Fen Chen; Prakash Periasamy; Troy L. Graves-abe; Chandrasekharan Kothandaraman; C. Collins; W. Landers; J. Oakley; J. Liu; John Safran; S. Ghosh; et al. (IEEE International Reliability Physics Symposium, IRPS 2015, Monterey, CA, USA, April 19-23, 2015, 2015)