Cross-sectional nanoprobing sample preparation on sub-micron device with fast laser grooving technique. - Tan, Pik Kee; Zhao, Yuzhe; Rivai, Francis; Liu, Binghai; Pan, Yanlin; He, Ran; Tan, Hao; Mai, Zhihong (Microelectron. Reliab., 2018)

Failure analysis on 14 nm FinFET devices with ESD CDM failure. - Chithambaram, Shaalini; Tan, Pik Kee; Zhao, Yuzhe; Liu, Binghai; Ma, Yinzhe; Quah, Alfred; Nagalingam, Dayanand; Pan, Yanlin; Mai, Zhihong (Microelectron. Reliab., 2018)

Application of Fast Laser Deprocessing Techniques on large cross-sectional view area sample with FIB-SEM dual beam system. - Zhao, Yuzhe; Wang, Q. J.; Tan, Pik Kee; Yap, Huei Hao; Liu, Binghai; Feng, H.; Tan, Hao; He, Ran; Huang, Y. M.; Wang, D. D.; Zhu, Lei; Chen, C. Q.; et al. (Microelectron. Reliab., 2016)

Top-down delayering to expose large inspection area on die side-edge with Platinum (Pt) deposition technique. - Yap, Huei Hao; Tan, Pik Kee; Low, G. R.; Dawood, M. K.; Feng, Hua; Zhao, Yuzhe; He, Ran; Tan, Hao; Zhu, J.; Liu, Binghai; Huang, Y. M.; Wang, D. D.; et al. (Microelectron. Reliab., 2015)