Opportunities, Challenges and Mitigations in 3DIC Design, Test, and Analyses - Pratyush Kamal; Anthony Mastroianni; Juan Rey; Antonio De la Serna (67th IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2024, Springfield, MA, USA, August 11-14, 2024, 2024)

Proposed Standardization of Heterogenous Integrated Chiplet Models - Anthony Mastroianni; Benjamin Kerr; Jawad Nasrullah; Kevin Cameron; Hockshan James Wong; David Ratchkov; Joseph A. Reynick (IEEE International 3D Systems Integration Conference, 3DIC 2021, Raleigh, NC, USA, October 26-29, 2021, 2021)