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Ming-Hwa R. Jen

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2000 – 2009

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2009
[j2]
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Ming-Hwa R. Jen, Lee-Cheng Liu, Yi-Shao Lai:
Electromigration on void formation of Sn3Ag1.5Cu FCBGA solder joints. Microelectron. Reliab. 49(7): 734-745 (2009)
2007
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Yi-Shao Lai, Tong Hong Wang, Han-Hui Tsai, Ming-Hwa R. Jen:
Cyclic bending reliability of wafer-level chip-scale packages. Microelectron. Reliab. 47(1): 111-117 (2007)

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