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Sung-Hoon Choa

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2020 – today

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2024
[c2]
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  dblp key:
  - conf/isocc/KimYYCK24
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  - https://dblp.org/rec/conf/isocc/KimYYCK24
Taehyun Kim, Junmo Yang, Chungmo Yang, Sung-Hoon Choa, Hee Yeoun Kim:
Wafer-level Packaging Platform for MEMS Sensor Applications. ISOCC 2024: 238-239

2010 – 2019

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2016
[j5]
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  - journals/mr/YangLJBC16
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Sang Min Yang, Yo Seb Lee, Yonghee Jang, Doyoung Byun, Sung-Hoon Choa:
Electromechanical reliability of a flexible metal-grid transparent electrode prepared by electrohydrodynamic (EHD) jet printing. Microelectron. Reliab. 65: 151-159 (2016)
2015
[j4]
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  - journals/mr/EunCYSC15
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Kyoungtae Eun, Min-Woo Chon, Tae-Hee Yoo, Yong-Won Song, Sung-Hoon Choa:
Electromechanical properties of printed copper ink film using a white flash light annealing process for flexible electronics. Microelectron. Reliab. 55(5): 838-845 (2015)
2014
[j3]
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  - journals/mr/YangCKLJYKC14
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Min Yang, Min-Woo Chon, Joo-Hyun Kim, Seung-Hyun Lee, Jeongdai Jo, Junyeob Yeo, Seung Hwan Ko, Sung-Hoon Choa:
Mechanical and environmental durability of roll-to-roll printed silver nanoparticle film using a rapid laser annealing process for flexible electronics. Microelectron. Reliab. 54(12): 2871-2880 (2014)
2011
[j2]
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  - journals/sensors/HwangSRLC11
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Woo-Jin Hwang, Kyu-Sik Shin, Ji-Hyoung Roh, Daesung Lee, Sung-Hoon Choa:
Development of Micro-Heaters with Optimized Temperature Compensation Design for Gas Sensors. Sensors 11(3): 2580-2591 (2011)
[c1]
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Sung-Hoon Choa, Haeng-Soo Lee, Kyoung-Ho Kim:
Numerical analysis of bonding process-induced deformation for 3D package. 3DIC 2011: 1-5

2000 – 2009

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2008
[j1]
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  - journals/mr/KimLJKCJ08
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Jong-Seok Kim, Sang-Woo Lee, Kyu-Dong Jung, Woon-Bae Kim, Sung-Hoon Choa, Byeong-Kwon Ju:
Quality factor measurement of micro gyroscope structure according to vacuum level and desired Q-factor range package method. Microelectron. Reliab. 48(6): 948-952 (2008)

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