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Eric Woirgard
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2010 – 2019
- 2018
- [j34]Omar Chihani, L. Théolier
, Alain Bensoussan
Effect of HTRB lifetest on AlGaN/GaN HEMTs under different voltages and temperatures stresses. Microelectron. Reliab. 88-90: 402-405 (2018) - [c1]Omar Chihani, Loic Théolier
Temperature and voltage effects on HTRB and HTGB stresses for AlGaN/GaN HEMTs. IRPS 2018: 2-1 - 2017
- [j33]Maxime Barrière, Alexandrine Guédon-Gracia, Eric Woirgard, Serge Bontemps, François Le Henaff:
Innovative conception of SiC MOSFET-Schottky 3D power inverter module with double side cooling and stacking using silver sintering. Microelectron. Reliab. 76-77: 431-437 (2017) - 2016
- [j32]Faical Arabi, Loic Théolier
Power electronic assemblies: Thermo-mechanical degradations of gold-tin solder for attaching devices. Microelectron. Reliab. 64: 409-414 (2016) - 2015
- [j31]Eric Woirgard
Identification and analysis of power substrates degradations subjected to severe aging tests. Microelectron. Reliab. 55(9-10): 1961-1965 (2015) - [j30]F. Baccar, Houssam Arbess
Ageing mechanisms in Deep Trench Termination (DT2) Diode. Microelectron. Reliab. 55(9-10): 1981-1987 (2015) - [j29]Toni Youssef, W. Rmili, Eric Woirgard, Stephane Azzopardi, N. Vivet, D. M. Meekhof, Régis Meuret, G. Le Quilliec, C. Richard:
Power modules die attach: A comprehensive evolution of the nanosilver sintering physical properties versus its porosity. Microelectron. Reliab. 55(9-10): 1997-2002 (2015) - [j28]Houssam Arbess
Mechanical stress investigation after technological process in Deep Trench Termination DT2 using BenzoCycloButene as dielectric material. Microelectron. Reliab. 55(9-10): 2017-2021 (2015) - 2013
- [j27]Wissam Sabbah, Stephane Azzopardi, Cyril Buttay
Study of die attach technologies for high temperature power electronics: Silver sintering and gold-germanium alloy. Microelectron. Reliab. 53(9-11): 1617-1621 (2013) - [j26]F. Baccar, Stephane Azzopardi, L. Théolier
Electrical characterization under mechanical stress at various temperatures of PiN power diodes in a health monitoring approach. Microelectron. Reliab. 53(9-11): 1719-1724 (2013) - 2012
- [j25]François Le Henaff, Stephane Azzopardi, Jean-Yves Delétage, Eric Woirgard, Serge Bontemps, Julien Joguet:
A preliminary study on the thermal and mechanical performances of sintered nano-scale silver die-attach technology depending on the substrate metallization. Microelectron. Reliab. 52(9-10): 2321-2325 (2012) - [j24]Akram Eddahech, Olivier Briat
Remaining useful life prediction of lithium batteries in calendar ageing for automotive applications. Microelectron. Reliab. 52(9-10): 2438-2442 (2012) - 2011
- [j23]Akram Eddahech, Olivier Briat
Ageing monitoring of lithium-ion cell during power cycling tests. Microelectron. Reliab. 51(9-11): 1968-1971 (2011) - [j22]Ramzi Chaari, Olivier Briat
How supercapacitors reach end of life criteria during calendar life and power cycling tests. Microelectron. Reliab. 51(9-11): 1976-1979 (2011) - 2010
- [j21]Olivier Briat
Contribution of calendar ageing modes in the performances degradation of supercapacitors during power cycling. Microelectron. Reliab. 50(9-11): 1796-1803 (2010) - [j20]Yassine Belmehdi, Stephane Azzopardi, Jean-Yves Delétage
Experimental electro-mechanical static characterization of IGBT bare die under controlled temperature. Microelectron. Reliab. 50(9-11): 1815-1821 (2010)
2000 – 2009
- 2009
- [j19]Alexandre Micol, A. Zeanh, T. Lhommeau, Stephane Azzopardi, Eric Woirgard, Olivier Dalverny
An investigation into the reliability of power modules considering baseplate solders thermal fatigue in aeronautical applications. Microelectron. Reliab. 49(9-11): 1370-1374 (2009) - [j18]H. El Brouji, Olivier Briat
Analysis of the dynamic behavior changes of supercapacitors during calendar life test under several voltages and temperatures conditions. Microelectron. Reliab. 49(9-11): 1391-1397 (2009) - [j17]Yassine Belmehdi, Stephane Azzopardi, A. Benmansour, Jean-Yves Delétage, Eric Woirgard:
Uni-axial mechanical stress effect on Trench Punch through IGBT under short-circuit operation. Microelectron. Reliab. 49(9-11): 1398-1403 (2009) - [j16]E.-Hassane El Brouji, Olivier Briat
Impact of Calendar Life and Cycling Ageing on Supercapacitor Performance. IEEE Trans. Veh. Technol. 58(8): 3917-3929 (2009) - 2008
- [j15]H. El Brouji, Olivier Briat
Comparison between changes of ultracapacitors model parameters during calendar life and power cycling ageing tests. Microelectron. Reliab. 48(8-9): 1473-1478 (2008) - 2007
- [j14]Adel Benmansour, Stephane Azzopardi, Jean-Christophe Martin, Eric Woirgard:
Trench IGBT failure mechanisms evolution with temperature and gate resistance under various short-circuit conditions. Microelectron. Reliab. 47(9-11): 1730-1734 (2007) - [j13]Walid Lajnef, Jean-Michel Vinassa, Olivier Briat
Monitoring fading rate of ultracapacitors using online characterization during power cycling. Microelectron. Reliab. 47(9-11): 1751-1755 (2007) - [j12]Adel Benmansour, Stephane Azzopardi, Jean-Christophe Martin, Eric Woirgard:
A step by step methodology to analyze the IGBT failure mechanisms under short circuit and turn-off inductive conditions using 2D physically based device simulation. Microelectron. Reliab. 47(9-11): 1800-1805 (2007) - 2006
- [j11]Olivier Briat
Power cycling tests for accelerated ageing of ultracapacitors. Microelectron. Reliab. 46(9-11): 1445-1450 (2006) - [j10]Adel Benmansour, Stephane Azzopardi, Jean-Christophe Martin, Eric Woirgard:
Failure mechanism of trench IGBT under short-circuit after turn-off. Microelectron. Reliab. 46(9-11): 1778-1783 (2006) - 2005
- [j9]Alexandrine Guédon-Gracia, Eric Woirgard, Christian Zardini:
Correlation between Experimental Results and FE Simulations to Evaluate Lead-Free BGA Assembly Reliability. Microelectron. Reliab. 45(9-11): 1652-1657 (2005) - [j8]Stephane Azzopardi, A. Benmansour, M. Ishiko, Eric Woirgard:
Assessment of the Trench IGBT reliability: low temperature experimental characterization. Microelectron. Reliab. 45(9-11): 1700-1705 (2005) - [j7]Walid Lajnef, Jean-Michel Vinassa, Olivier Briat
Specification and use of pulsed current profiles for ultracapacitors power cycling. Microelectron. Reliab. 45(9-11): 1746-1749 (2005) - 2004
- [j6]Alexandrine Guédon-Gracia, Pascal Roux, Eric Woirgard, Christian Zardini:
Influence of the thermo-mechanical residual state on the power assembly modellization. Microelectron. Reliab. 44(9-11): 1331-1335 (2004) - 2003
- [j5]Alexandrine Guédon, Eric Woirgard, Christian Zardini, Guillaume Simon:
Methodology to evaluate the correspondence between real conditions and accelerated tests of a thyristor system used in a power plant. Microelectron. Reliab. 43(9-11): 1853-1858 (2003) - [j4]Stephane Azzopardi, Eric Woirgard, Jean-Michel Vinassa, Olivier Briat
IGBT Power modules thermal characterization : what is the optimum between a low current - high voltage or a high current - low voltage test condition for the same electrical power? Microelectron. Reliab. 43(9-11): 1901-1906 (2003) - 2002
- [j3]P. Guilbault, Eric Woirgard, Christian Zardini, D. Lambert:
Reliability study of the assembly of a large EGA on a build up board using thermo-mechanical simulations. Microelectron. Reliab. 42(9-11): 1529-1533 (2002) - [j2]Alexandrine Guédon, Eric Woirgard, Christian Zardini:
Evaluation of lead-free soldering for automotive applications. Microelectron. Reliab. 42(9-11): 1555-1558 (2002) - 2001
- [j1]Stephane Azzopardi, Atsuo Kawamura
Local lifetime control IGBT structures: turn-off performances comparison for hard- and soft-switching between 1200V trench and new planar PT-IGBTs. Microelectron. Reliab. 41(9-10): 1731-1736 (2001)
Coauthor Index
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