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"On signalling over Through-Silicon Via (TSV) interconnects in 3-D ..."
Roshan Weerasekera et al. (2010)
- Roshan Weerasekera
, Matt Grange, Dinesh Pamunuwa
, Hannu Tenhunen:
On signalling over Through-Silicon Via (TSV) interconnects in 3-D Integrated Circuits. DATE 2010: 1325-1328
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