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"Research status and analysis of the surface insulation of the junction ..."

Xizi Zhang et al. (2020)

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DOI: 10.1145/3443467.3443921

access: closed

type: Conference or Workshop Paper

metadata version: 2023-08-04

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Xizi Zhang, Xinling Tang, Shu Chen, Liang Wang, Zhongkang Lin, Yang Zhou:
Research status and analysis of the surface insulation of the junction terminal of Press Pack IGBT Chips. EITCE 2020: 1153-1161

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