<?xml version="1.0" encoding="US-ASCII"?>
<dblp>
<inproceedings key="conf/isia2/ShiJY23" mdate="2025-01-19">
<author orcid="0009-0006-5160-8851">Weihe Shi</author>
<author orcid="0009-0006-3628-959X">Chenzhong Jia</author>
<author orcid="0009-0003-2686-3461">Wenqing Ye</author>
<title>Research on the Application of Injection Molding Simulation Technology in Mold Design.</title>
<pages>20:1-20:8</pages>
<year>2023</year>
<booktitle>ISIA</booktitle>
<ee>https://doi.org/10.1145/3632314.3632339</ee>
<ee>https://www.wikidata.org/entity/Q130893210</ee>
<crossref>conf/isia2/2023</crossref>
<url>db/conf/isia2/isia2023.html#ShiJY23</url>
</inproceedings>
</dblp>
