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"Characterizing the Thermal Feasibility of Monolithic 3D Microprocessors."

Ji Heon Lee et al. (2021)

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DOI: 10.1109/ACCESS.2021.3108628

access: open

type: Journal Article

metadata version: 2021-09-16

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  dblp key:
  - journals/access/LeeLCAKGC21
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  - https://dblp.org/rec/journals/access/LeeLCAKGC21
Ji Heon Lee, Young Seo Lee, Jeong Hwan Choi, Hussam Amrouch, Joonho Kong, Young-Ho Gong, Sung Woo Chung:
Characterizing the Thermal Feasibility of Monolithic 3D Microprocessors. IEEE Access 9: 120715-120729 (2021)

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