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"Characterizing the Thermal Feasibility of Monolithic 3D Microprocessors."
Ji Heon Lee et al. (2021)
- Ji Heon Lee, Young Seo Lee, Jeong Hwan Choi, Hussam Amrouch, Joonho Kong, Young-Ho Gong, Sung Woo Chung:
Characterizing the Thermal Feasibility of Monolithic 3D Microprocessors. IEEE Access 9: 120715-120729 (2021)
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