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"Forensic smartphone analysis using adhesives: Transplantation of Package ..."

Thibaut Heckmann et al. (2018)

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DOI: 10.1016/J.DIIN.2018.05.005

access: closed

type: Journal Article

metadata version: 2022-04-09

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  - https://dblp.org/rec/journals/di/HeckmannMNS18
Thibaut Heckmann, Konstantinos Markantonakis, David Naccache, Thomas R. Souvignet:
Forensic smartphone analysis using adhesives: Transplantation of Package on Package components. Digit. Investig. 26: 29-39 (2018)

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