A High Layer Scalability TSV-Based 3D-SRAM With Semi-Master-Slave Structure and Self-Timed Differential-TSV for High-Performance Universal-Memory-Capacity-Platforms.

Meng-Fan Chang Chih-Sheng Lin Wei-Cheng Wu Ming-Pin Chen Yen-Huei Chen Zhe-Hui Lin Shyh-Shyuan Sheu Tzu-Kun Ku Cha-Hsin Lin Hiroyuki Yamauchi A High Layer Scalability TSV-Based 3D-SRAM With Semi-Master-Slave Structure and Self-Timed Differential-TSV for High-Performance Universal-Memory-Capacity-Platforms. 1521-1529 2013 June 48 IEEE J. Solid State Circuits 6 https://doi.org/10.1109/jssc.2013.2253413 db/journals/jssc/jssc48.html#ChangLWCCLSKLY13