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"Warpage evolution of overmolded ball grid array package during post-mold ..."

Tz-Cheng Chiu, Hong-Wei Huang, Yi-Shao Lai (2011)

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DOI: 10.1016/J.MICROREL.2011.06.001

access: closed

type: Journal Article

metadata version: 2020-02-22

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Tz-Cheng Chiu, Hong-Wei Huang, Yi-Shao Lai:
Warpage evolution of overmolded ball grid array package during post-mold curing thermal process. Microelectron. Reliab. 51(12): 2263-2273 (2011)

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