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"Reliability investigation of large area solder joints in power electronics ..."

Allen Jose George et al. (2018)

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DOI: 10.1016/J.MICROREL.2018.06.049

access: closed

type: Journal Article

metadata version: 2020-02-22

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  - https://dblp.org/rec/journals/mr/GeorgeZBKN18
Allen Jose George, Juergen Zipprich, Marlies Breitenbach, Markus Klingler, Mathias Nowottnick:
Reliability investigation of large area solder joints in power electronics modules and its simulative representation. Microelectron. Reliab. 88-90: 762-767 (2018)

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