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"Assessment of ultra-thin Si wafer thickness in 3D wafer stacking."

Eun-Kyung Kim (2010)

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DOI: 10.1016/J.MICROREL.2009.10.002

access: closed

type: Journal Article

metadata version: 2020-02-22

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Eun-Kyung Kim:
Assessment of ultra-thin Si wafer thickness in 3D wafer stacking. Microelectron. Reliab. 50(2): 195-198 (2010)

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