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"A reliability-driven placement procedure based on thermal-force model."

Jing Lee (2006)

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DOI: 10.1016/J.MICROREL.2005.04.015

access: closed

type: Journal Article

metadata version: 2020-02-22

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Jing Lee:
A reliability-driven placement procedure based on thermal-force model. Microelectron. Reliab. 46(5-6): 973-983 (2006)

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