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"Failure analysis of through-silicon vias in free-standing wafer under ..."

Xi Liu et al. (2013)

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DOI: 10.1016/J.MICROREL.2012.06.140

access: closed

type: Journal Article

metadata version: 2020-02-22

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Xi Liu, Qiao Chen, Venkatesh Sundaram, Rao R. Tummala, Suresh K. Sitaraman:
Failure analysis of through-silicon vias in free-standing wafer under thermal-shock test. Microelectron. Reliab. 53(1): 70-78 (2013)

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