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"Temperature profile effects in accelerated thermal cycling of SnPb and ..."

Yan Qi et al. (2006)

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DOI: 10.1016/J.MICROREL.2005.01.008

access: closed

type: Journal Article

metadata version: 2020-02-22

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Yan Qi, Rex Lam, Hamid R. Ghorbani, Polina Snugovsky, Jan K. Spelt:
Temperature profile effects in accelerated thermal cycling of SnPb and Pb-free solder joints. Microelectron. Reliab. 46(2-4): 574-588 (2006)

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