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"A multi-port thermal coupling model for multi-chip power modules suitable ..."

Zhongxu Wang et al. (2018)

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DOI: 10.1016/J.MICROREL.2018.06.031

access: closed

type: Journal Article

metadata version: 2020-02-22

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Zhongxu Wang, Huai Wang, Yi Zhang, Frede Blaabjerg:
A multi-port thermal coupling model for multi-chip power modules suitable for circuit simulators. Microelectron. Reliab. 88-90: 519-523 (2018)

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